Toshiba GR200 Series Instruction Manual

Also see for GRB200: Instruction manual

6F2S1931 (0.20)Centralized GRB200(Soft: 030, 031, 032, 033, 034)267Signal processing and communication modules (CPU)Signal-processing and communication module (CPU), for the ‘Max dual ports’ of MainUnit, ismade up of a main circuit board for processing (CP1M) and ‘piggyback’ circuit boards forcommunication modules (COM). These circuit boards are used for LAN, time synchronizationand others. The circuit boards are mounted on CPU and are provided with connectors on theirprinted circuit board (PCB).OPT2CPUSubUnitCOMCP1MMicroprocessorOPT2COMCOMCPUCPU for the Max. dual portsMainUnitFigure 4.3-1 CPU structure for the Max. Dual PortsRelay operations, controlling etc. are achieved with microprocessor on the CP1M. It hasSDRAM, MRAM, and NOR-Flash. The NOR-Flash is used to store setting data and recordingdata; the MRAM is used to store several counter values. Both are of non-volatile memory sothat the stored data will be not be erased if the power is cut off.Another layout is Figure 4.3-2 designed for the ‘Dual ports with LAN for Local PC’: MainUnithas five COMs on CPU and OPT2 module on PCX to perform upstream communication.SubUnit has OPT2 module on CPU operating only for the Main–SubUnit communication.COMCP1MCPUMicroprocessor OPT2COMCOMCOMCOMPCXCPU for the Dual ports with LAN for Local PCOPT2CPUSubUnitMainUnitFigure 4.3-2 CPU structure for the Dual Ports with LAN for Local PCRegarding with the ‘Stand-alone’ type of MainUnit, the CPU can have five COMs. It does notinclude OPT2 module.