TOBY-R2 series - System integration manualUBX-16010572 - R10 Design-in Page 118 of 1512.11 Module footprint and paste maskFigure 67 and Table 50 describe the suggested footprint (i.e. copper mask) layout for TOBY-R2 seriesmodules. The proposed land pattern layout slightly reflects the modules’ pads layout, with most ofthe lateral pads designed wider on the application board (1.8 x 0.8 mm) than on the module(1.5 x 0.8 mm).I1AG H J1D F2K M1 M1 M2 P2B GHJOOLNM1 M1 M3I1I1O HJJJEP3F1P1HI1OI2I2F2Module placement outlineFigure 67: TOBY-R2 series module suggest footprint (application board top view)Parameter Value Parameter Value Parameter ValueA 35.6 mm H 0.80 mm M2 5.20 mmB 24.8 mm I1 1.50 mm M3 4.50 mmD 2.40 mm I2 1.80 mm N 2.10 mmE 2.25 mm J 0.30 mm O 1.10 mmF1 1.45 mm K 3.15 mm P1 1.10 mmF2 1.30 mm L 7.15 mm P2 1.25 mmG 1.10 mm M1 1.80 mm P3 2.85 mmTable 50: TOBY-R2 series module suggest footprint dimensionsThe Non Solder resist Mask Defined (NSMD) pad type is recommended over the Solder resist MaskDefined (SMD) pad type, implementing the solder mask opening 50 μm larger per side than thecorresponding copper pad.The suggested paste mask layout for TOBY-R2 series modules slightly reflects the copper masklayout described in Figure 67 and Table 50, as different stencil apertures layout for any specific pad isrecommended: Blue marked pads: Paste layout reduced circumferentially about 0.025 mm to Copper layout Green marked pads: Paste layout enlarged circumferentially about 0.025 mm to Copper layout Purple marked pads: Paste layout one to one to Copper layoutThe recommended solder paste thickness is 150 μm, according to application production processrequirements.☞ These are recommendations only and not specifications. The exact mask geometries, distancesand stencil thicknesses must be adapted to the specific production processes (e.g. soldering etc.)of the customer.