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Samsung OFFICESERV 7100 Service Manual Manual pdf 13 page image

Samsung OFFICESERV 7100 Service Manual

Also see for OFFICESERV 7100: Quick guideSystem administration guideUser guideUser manualUser guide

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Contents
  1. CHAPTER 4. Programming for Maintenance
  2. Table Of Contents
  3. Table Of Contents
  4. Table Of Contents
  5. Table Of Contents
  6. Table Of Contents
  7. Table Of Contents
  8. Table Of Contents
  9. CHAPTER 1. System Overview
  10. System Configuration
  11. Organization of Slots
  12. System Specification
  13. Table 1.4 C.O. line Capacity
  14. Eelectrical Standard
  15. Table 1.8 Electric Characteristics of E1 C.O. line
  16. Table 1.11 Electric Characteristics of DLI Line
  17. Power Specifications
  18. Ring and Tone
  19. Available Terminals
  20. CHAPTER 2. Circuit Overview
  21. Features of the Communication System between Modules
  22. Main Board
  23. Figure 2.3 MP10/11 Board Block Diagram
  24. MP11 Board
  25. Universal Board
  26. Figure 2.4 UNI Board Block Diagram
  27. TRM Module
  28. Figure 2.6 Block Diagram of the DAA Chip
  29. Figure 2.7 Block Diagram of the QSLAC Part
  30. TRK Module
  31. Figure 2.9 Block Diagram of the C.O Line Interface Circuit
  32. BRM Module
  33. Figure 2.11 Layout between the 2BRM and UNI Boards
  34. TEPRI2 Board
  35. SLM Module
  36. SLI2/16MWSLI Board
  37. Figure 2.14 Block Diagram of the 16SLI2/16MWSLI Boards
  38. HYB/8COMBO Board
  39. Figure 2.16 8HYB/8COMBO SLI Block Diagram
  40. DLM Module
  41. Figure 2.18 QDASL Block Diagram
  42. DLI Board
  43. Figure 2.20 Block Diagram of the 8DLI Board
  44. Figure 2.21 Default Configuration Diagram Between the Digital Phone and System
  45. DLI/16DLI2 Board
  46. Figure 2.23 Block Diagram of the 16DLI Board
  47. MGI64/MGI16 Board
  48. PLIM Board
  49. Figure 2.26 PoE Strap Option of PLIM Board
  50. Figure 2.27 4SWM Configuration Diagram
  51. Figure 2.28 Block Diagram of 4SWM Module
  52. WBS24 BTS
  53. Figure 2.30 Phone System Connection Diagram
  54. Table 2.2 System Configuration Inter-Working With WBS24
  55. MODEM Board
  56. Figure 2.32 PCM Interface of Modem Board
  57. Terminal
  58. Figure 2.34 Block Diagram of Door Phone
  59. Figure 2.35 Pin Connection of DPIM
  60. CHAPTER 3. Troubleshooting
  61. Abnormal Battery Backup (1)
  62. Abnormal Battery Backup (2)
  63. Checking MP10/11 Board Operation
  64. Calls are not Connected (Highway)
  65. Calls are not Connected (Switching Clock)
  66. Music on Hold (MOH)/Background Music sources (BGM) is Abnormal
  67. External Announcement is not Available
  68. Motherboard
  69. V Power is not Supplied to Motherboard
  70. Control Board
  72. UNI Board
  75. TRK Board
  77. COMBO Board
  81. Option Board (Daughter Board)
  82. MFM Board
  83. RCM Board
  84. Smart Media Programming
  85. Figure 4.1 Initial Window of the Smart Media Program
  86. Performing Functions
  87. Figure 4.3 SMC Format
  88. Figure 4.4 [Copy Menu] Window
  89. Figure 4.5 [Directory Menu] Window
  90. Figure 4.6 [Copy Menu] Window
  91. CPLD Programming
  92. Figure 4.8 Initial Window of the ispVM Program
  93. Figure 4.9 [LatticePRO ver 0.1] Window
  94. Figure 4.10 [LatticePRO ver 0.1-Chain1] Window
  95. Figure 4.12 Designating the Part Name on the [JTAG Part Properties] Window
  96. Figure 4.14 Designating the Programming Mode and the JEDEC File Path
  97. Figure 4.15 Program Execution
  98. Figure 4.16 Programming for the MP10/11 Option Board
  99. Figure 4.17 Changing Information of Part1
  100. Altera EPLD Programming
  101. Figure 4.20 Program File Selection
  102. Figure 4.22 Data File Download
  103. Offline Programming
  104. Entering the Offline Test Mode
  105. CHAPTER 5. Parts Layout
  106. MP10/11 Board
  108. COMBO
  109. DLI2
  110. MGI16/MGI32
  111. SLI2/16MWSLI
  114. Modem
  115. CHAPTER 6. Parts List
  116. MP10 Board
  118. SWM Module
  126. DLI2 Board
  127. MGI64 Board
  128. MGI16 Board
  130. PLIMD Board
  133. CHAPTER 7. Device Parts Diagram
  134. Figure 7.2 Front/Rear Panels of the Power Module
Samsung OFFICESERV 7100 Service Manual Manual pdf 13 page image
OfficeServ 7100 Service Manual© SAMSUNG Electronics Co., Ltd. XI3.4.1 4SWM Module........................................................................................................................3-183.4.2 UNI Board ...............................................................................................................................3-203.4.3 4TRM Module.........................................................................................................................3-233.4.4 4SLM Module .........................................................................................................................3-253.4.5 8TRK Board............................................................................................................................3-263.4.6 TEPRI2 Board ........................................................................................................................3-303.4.7 8COMBO Board .....................................................................................................................3-373.4.8 16SLI2/16MWSLI Board........................................................................................................3-423.4.9 MGI64/MGI16 Board .............................................................................................................3-463.4.10 PLIM Board.............................................................................................................................3-503.5 Option Board (Daughter Board) ............................................................................................ 3-523.5.1 MIS Board...............................................................................................................................3-523.5.2 MFM Board.............................................................................................................................3-563.5.3 RCM Board.............................................................................................................................3-59CHAPTER 4. Programming for Maintenance 4-14.1 Smart Media Programming ...................................................................................................... 4-14.1.1 Installation.................................................................................................................................4-14.1.2 Performing Functions...............................................................................................................4-34.2 CPLD Programming.................................................................................................................. 4-84.2.1 Lattice CPLD Programming ....................................................................................................4-84.2.2 Altera EPLD Programming ....................................................................................................4-174.3 Offline Programming .............................................................................................................. 4-204.3.1 Preparation .............................................................................................................................4-204.3.2 Environment Configuration ....................................................................................................4-204.3.3 Entering the Offline Test Mode ..............................................................................................4-21CHAPTER 5. Parts Layout 5-15.1 MP10/11 Board .......................................................................................................................... 5-25.2 4SWM ......................................................................................................................................... 5-45.3 4DLM .......................................................................................................................................... 5-55.4 4TRM .......................................................................................................................................... 5-65.5 4SLM........................................................................................................................................... 5-75.6 2BRM .......................................................................................................................................... 5-85.7 TEPRI2 Board ............................................................................................................................ 5-95.8 8COMBO .................................................................................................................................. 5-115.9 16DLI2 ...................................................................................................................................... 5-13
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