USR IOT USR-WIFI232-T User Manual

Contents

USR IOT USR-WIFI232-T User Manual Manual pdf 60 page image

Low power WIFI module user manual http://en.usr.cnJinan USR IOT Technology Limited tec@usr.cnPage 60/725. PACKAGE INFORMATION5.1. Recommended Reflow ProfileFigure 33. Reflow Soldering ProfileTable 11 Reflow Soldering ParameterNote: 1. Recommend to supply N2 for reflow oven.2. N2 atmosphere during reflow (O2<300ppm)5.2. Device Handling Instruction (Module IC SMT Preparation)1. Shelf life in sealed bag: 12 months, at <30℃ and <60% relativehumidity (RH)2. After bag is opened, devices that will be re-baked required afterlast baked with window time 168 hours.3. Recommend to oven bake with N2 supplied4. Recommend end to reflow oven with N2 supplied5. Baked required with 24 hours at 125+-5℃ before rework process fortwo modules, one is new module and two is board with module6. Recommend to store at ≦10% RH with vacuum packing7. If SMT process needs twice reflow:(1) Top side SMT and reflow  (2) Bottom side SMT and reflowCase 1: Wifi module mounted on top side. Need to bake when bottomside process over 168 hours window time, no need to bake within 168hoursCase 2: Wifi module mounted on bottom side, follow normal bake rulebefore processNO. Item Temperature (Degree) Time(Sec)1 Reflow Time Time of above220 35~55 sec2 Peak-Temp 260 max