Toshiba e-STUDIO200L Service Manual

Also see for e-STUDIO200L: User guide Operator's guide Service manual Service handbook Service handbook

Contents

2© 2004 - 2008 TOSHIBA TEC CORPORATION All rights reserved e-STUDIO200L/202L/203L/230/232/233/280/282/283OUTLINE OF THE MACHINE2 - 29• LDR board:This is the board on which the laser diode and the ASIC are mounted. The laser is emitted based onthe output image data signal from the ASIC on the LGC board.• SNS board:This is the board on which the light sensor for detecting the radiating position of the laser ismounted.It outputs the H-sync signal to ASIC on the LGC board.• LRL board:This is the board to relay each signal transmitted between the LGC board and laser unit (LDR andSNS boards).• ADU board:This is the board to relay each signal between the ASIC on the LGC board and the electric parts(motor, sensor, clutch) in the ADU.• SYS board:This is the main board taking a leading part in all systems. It consists of the System-CPU, ASIC,memory (DIMM, SDRAM, Flash ROM, SRAM, NVRAM), RTC (Real Time Clock IC), etc. The Sys-tem-CPU controls each ASIC to perform the control of the image processing, image memory (pagememory, main memory, HDD), external interface (IEEE-1284, USB, PCI), NIC and FAX.Based on the input data from the control panel, the System-CPU communicates with the Scanner-CPU on the SLG board and Engine-CPU on the LGC board, and then issues an operation commandto the scanner and printer engine section.• LGC board:This is the board to mainly control the printing function (printer engine). It consists of the Engine-CPU, ASIC, memory (Flash ROM, SRAM, NVRAM), driver for motor drive, etc. The Engine-CPUcontrols each ASIC to drive I/O (for the electrical parts) of each section in the system. It leads to theoperation of the laser unit, developer unit, drum, drawers, bypass unit, ADU, etc. Thus printing isperformed.• NIC board (e-STUDIO200L/230/230L/280/280S):This is the interface board to connect this equipment to the LAN environment (10BASE-T,100BASETX) to communicate with PCs, etc.• FIL board:This is the board to cut off the noise of AC power from outside, and supply the driving AC power tothe damp heater for condensation prevention of each section (scanner and drum).• FUS board:This is the board to provide the AC electric power for driving to the damp heater for preventing of thecondensation of each section (scanner and drum).• HVT:This is the board to generate the DC high voltage from +24V to provide the bias to the section of themain charger, developer, transfer, and separation.• PS-ACC:This is the unit to generate each DC voltage, which is used in the equipment, from external AC elec-tric power input. And then it is provided to each electrical part.05/11