● High density placing for digital signal circuits・Bussed 8 or 15 resistors for pull up/down circuitsEXBD : 3.2 mm × 1.6 mm × 0.55 mm, 0.635 mm pitchEXBE : 4.0 mm × 2.1 mm × 0.55 mm,0.8 mm pitchEXBA : 6.4 mm × 3.1 mm × 0.55 mm,1.27 mm pitchEXBQ : 3.8 mm × 1.6 mm × 0.45 mm,0.5 mm pitch・Available direct placing on the bus line by means of half pitch spacing without through-holeson PWB (“High density placing” is shown below)● High speed mounting using conventional placing machine● Reference Standard : IEC 60115-9, JIS C 5201-9, EIAJ RC-2130● RoHS compliant■ As for packaging methods, land pattern, soldering conditions and safety precautions,please see data files.Note : Please check the "Ratings" for the presence/absence of part numbers for combinations of the symbols below.±5 %Number ofterminals CodeC16Terminals(EXBQ)Resistance toleranceCommon terminal positionThe first two digitsare significantfigures ofresistance valueand the third onedenotes thenumber of zerosfollowing.Diagonal common circuit(Terminal 5 and Terminal 10) (EXBA)One side common circuit(Terminal 16) (EXBQ)EPP1-Mar-20Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.Diagonal common circuit(Terminal 1 and Terminal 6) (EXBA)JDEAQ4.0×2.16.4×3.13.8×1.6160825121506Should a safety concern arise regarding this product, please be sure to contact us immediately.CodeChip Resistors NetworksFeaturesExplanation of part numbers1206Thick FilmResistorNetworksEXB D, E, A, Q seriesEXB typeDimensions (mm)Circuit configurationCenter common circuit(EXBD,EXBE)10Terminals(EXBD)(EXBE)(EXBA)Dimension code ofchip resistor network3.2×1.6InchProduct codeToleranceCodeResistance value1 2 3 4 5 6 7 8 9 10 11E X B E 1 0 C 1 0 3 J12Suffix for special requirements【High density placing】Pull up resistorsEXBE10CDirect placement on the bus lineVccIC IC IC ICIC ICThrough holesNo through holeVcc Vcc0.635 mm pitch0.4 mm pitchEXBA10P