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Karl Suss MA6 Operating Manual
Also see for MA6: Operating manual
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NANOSYSTEM FABRICATION FACILITY (NFF), HKUSTVersion 1.1 Page 20 of 24contact modes. Use the “Alignment/Cont” key instead.5. Press “ALIGNMENT CHECK” key again to exit this mode, and if alignment isacceptable, proceed to expose wafer section.4.12 Wafer ExposureLamp power supply should be in CH1 (Constant Intensity @365nm) mode. Thecurrent system intensity setting value is shown in front of the machine. Check processinformation or expose test wafer to determine proper exposure time for your needs.1. If exposure time, as displayed needs to be changed, press “EDITPARAMETER” key. Toggle with “X-ARROW” key to EXP. TIME, and use“Y-ARROW” keys to change exposure time and then press the “EDITPARAMETER” key again. The LCD readout should reflect the changedexposure time.2. Press “EXPOSURE” key, Watch out as Top Side alignment Microscope moveup and exposure assembly slide out to expose wafer. (Despite the exposure wasinitiated pressing the “UNLOAD” key before the light shutter has opened willcontinue its exposure program sequence without wafer exposure).3. Verify exposure power (270-400W) during exposure on lamp readout.4. After exposure, microscope drops down and wafer chuck moves down to unloadthe exposed wafer.5. The machine instructs: “Pull Slide and unload exposed substrate”. Load anothersubstrate if desired. Otherwise, move the transport slide back into the machine.6. Press flashing “ENTER” key followed by “LOAD” key and “ENTER” keyagain.7. Repeat wafer alignment and exposure procedure as describe above.Note: You should develop and inspect the first wafer before you expose the secondwafer, you might need to adjust the exposure time. |
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