4018Disassemble thescrew*4(M3*7.5L),and take off theHSINK and DMD chipwith Chip BD.screwdriver19(1)Disassemble thebaffle DMD.(2)Disassemble thescrew*3(M3*4L) andtake off the CWmodule.screwdriver20Rotate to open theswitch on socket, andtake off the DMDchip.screwdriver21(1)Disassemble ILLmodule screw*2(M2.5*5L).(2)Take offscrew*1(M2*8L), FMholder, fold mirror, FMclip*2, clip CM front,clip CM side andsponge.screwdriver22(1)Disassembly thescrew*1(M2*3L).(2)Take off the LPmodule and LPscrew*2(M2*8L).screwdriver12343screw*112spongescrew*11212CW modulebaffle DMDL/PNote: Circuit boards > 10cm2 has been highlighted with the yellowrectangle as above image shows. Please detach the Circuit boards andfollow local regulations for disposal.
