Toshiba HX-MU900 Manual
Also see for HX-MU900: Manual
Preparation:- Remove IC2 (EPROM on IC socket).- Remove the solder tin from the pin holes at the empty place of IC3.- Remove the solder tin from the pin holes at the empty place of IC6.- Remove the solder tin from the pin holes at the empty place of C21.- Remove wire bridge J2.- Remove wire bridge J8.Installation (upper side PCB):- Shorten pin 1 of the new EPROM.- Place the new EPROM with the remaining pins in the empty IC socket (IC2).- Place the SRAM memory chip (SRM2264C) in the empty slot of IC3.- 74LS139, shorten pins 1, 2, 3, 13, 14 and 15.- Place the 74LS139 with the remaining pins in the empty place of IC6.- Place the 47 μF capacitor in the empty place of C21.- Place the 0.1 μF capacitor between pin 8 of IC6 (74LS139) and the right side of R1.- Connect the right side of J6 to the right side of J9.- Connect pin 1 of IC6 (74LS139) to pin 14 of the slot connector.- Connect pin 2 of IC6 (74LS139) to pin 3 of IC6 (74LS139) and the left side of J3.- Connect pin 4 of IC6 (74LS139) to the right side of J4.- Connect pin 7 of IC6 (74LS139) to the left side of J1.- Connect pin 13 of IC6 (74LS139) to pin 26 of IC3 (SRM2264C).- Connect pin 14 of IC6 (74LS139) to pin 2 of IC3 (SRM2264C).- Connect pin 15 of IC6 (74LS139) to pin 1 of IC2 (EPROM) and pin 9 of IC1 (Y8950).- Connect pin 26 of IC1 (Y8950) to the right side of J7.MSX-Audio Basic with accessory components. |
Related manuals for Toshiba HX-MU900
This manual is suitable for:
Product
Menu
Learn More
Menu
Legal
Menu
Copyright © 2024 OneStart. All Rights Reserved