Toshiba 26HF66 Service Manual

Also see for 26HF66: Owner's manual Specifications

Contents

(*1) GREEN PRODUCT PROCUREMENTThe EC is actively promoting the WEEE & RoHS Directives that define standards for recyclingand reuse of Waste Electrical and Electronic Equipment and for the Restriction of the use ofcertain Hazardous Substances. From July 1, 2006, the RoHS Directive will prohibit anymarketing of new products containing the restricted substances.Increasing attention is given to issues related to the global environmental. Toshiba Corporationrecognizes environmental protection as a key management tasks, and is doing its utmost toenhance and improve the quality and scope of its environmental activities. In line with this,Toshiba proactively promotes Green Procurement, and seeks to purchase and use products,parts and materials that have low environmental impacts.Green procurement of parts is not only confined to manufacture. The same green parts used inmanufacture must also be used as replacement parts.(*2) LEAD-FREE SOLDERThis product is manufactured using lead-free solder as a part of a movement within the consumerproducts industry at large to be environmentally responsible. Lead-free solder must be used inthe servicing and repair of this product.WARNINGThis product is manufactured using lead free solder.DO NOT USE LEAD BASED SOLDER TO REPAIR THIS PRODUCT !The melting temperature of lead-free solder is higher than that of leaded solder by 86°F to 104°F(30°C to 40°C). Use of a soldering iron designed for lead-based solders to repair product madewith lead-free solder may result in damage to the component and or PCB being soldered. Greatcare should be made to ensure high-quality soldering when servicing this product  especiallywhen soldering large components, through-hole pins, and on PCBs  as the level of heatrequired to melt lead-free solder is high.A1-1