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Siemens CPU 314C-2 DP manuals

CPU 314C-2 DP first page preview

CPU 314C-2 DP

Brand: Siemens | Category: Computer Hardware
Table of contents
  1. A5E00105475
  2. Memory concept
  3. Table Of Contents
  4. Table Of Contents
  5. Table Of Contents
  6. Table Of Contents
  7. Table Of Contents
  8. Guide to the S7-300 documentation
  9. Table 1-3 Communication between sensors/actuators and the PLC
  10. Table 1-6 CPU performance
  11. Table 1-9 Supplementary features
  12. Operating and display elements
  13. Status and Error Indicators: CPU 31xC
  14. Operating and display elements: CPU 31x
  15. Operating and display elements: CPU 317-2 DP
  16. Operating and display elements: CPU 31x-2 PN/DP
  17. Operating and display elements: CPU 319-3 PN/DP
  18. Status and error displays of CPU 31x
  19. Communication
  20. PROFIBUS DP
  21. PROFINET (PN)
  22. Point to Point (PtP)
  23. Communication services
  24. PG communication
  25. OP communication
  26. Global data communication (MPI only)
  27. Routing
  28. Point-to-point connection
  29. Communication by means of PROFINET
  30. PROFINET IO System
  31. Blocks in PROFINET IO
  32. System status lists (SSLs) in PROFINET IO
  33. Table 3-9 Comparison of the System Status Lists of PROFINET IO and PROFIBUS DP
  34. Open communication via Industrial Ethernet
  35. SNMP communication service
  36. Assignment of S7 connections
  37. Distribution and availability of S7 connection resources
  38. Table 3-11 Availability of connection resources
  39. Connection resources for routing
  40. DPV1
  41. Memory areas and retentivity
  42. Retentivity of load memory, system memory and RAM
  43. Retentivity of memory objects
  44. Address areas of system memory
  45. Properties of the SIMATIC Micro Memory Card (MMC)
  46. Memory functions
  47. Handling with modules
  48. Deleting blocks
  49. CPU memory reset and restart
  50. Recipes
  51. Measured value log files
  52. Backup of project data to SIMATIC Micro Memory Card (MMC)
  53. Cycle and reaction times
  54. Calculating the cycle time
  55. Different cycle times
  56. Communication load
  57. Cycle time extension as a result of testing and commissioning functions
  58. Response time
  59. Shortest response time
  60. Longest response time
  61. Reducing the response time with direct I/O access
  62. Calculating method for calculating the cycle/response time
  63. Interrupt response time
  64. Reproducibility of Time-Delay and Watchdog Interrupts
  65. Sample of response time calculation
  66. Example of interrupt response time calculation
  67. Technical data of CPU 31xC
  68. Technical specifications of the Micro Memory Card (MMC)
  69. CPU 312C
  70. CPU 313C
  71. CPU 313C-2 PtP and CPU 313C-2 DP
  72. CPU 314C-2 PtP and CPU 314C-2 DP
  73. Technical data of the integrated I/O
  74. Analog I/O
  75. Parameterization
  76. Interrupts
  77. Diagnostics
  78. Digital inputs
  79. Digital outputs
  80. Analog inputs
  81. Analog outputs
  82. Technical data of CPU 31x
  83. Technical specifications of the SIMATIC Micro Memory Card (MMC)
  84. technical data
  85. CPU 315-2 DP
  86. CPU 315-2 PN/DP
  87. CPU 317-2 DP
  88. CPU 317-2 PN/DP
  89. CPU 319-3 PN/DP
  90. A.1 Information about upgrading to a CPU 31xC or CPU 31x
  91. A.1.2 Changed behavior of certain SFCs
  92. A.1.3 Interrupt events from distributed I/Os while the CPU status is in STOP
  93. A.1.5 Converting the diagnostic addresses of DP slaves
  94. A.1.7 Replacing a CPU 31xC/31x
  95. A.1.9 Load memory concept for the CPU 31xC/31x
  96. A.1.12 Changed retentive behavior for CPUs with firmware >= V2.1.0
  97. A.1.14 Using loadable blocks for S7 communication for the integrated PROFINET interface
  98. Glossary
  99. product information
CPU 314C-2 DP first page preview

CPU 314C-2 DP

Brand: Siemens | Category: Processor
Table of contents
  1. Edition
  2. Table Of Contents
  3. Table Of Contents
  4. Table Of Contents
  5. Table Of Contents
  6. Table Of Contents
  7. Table Of Contents
  8. Table Of Contents
  9. Information Landscape of S7-300
  10. Additional Documentation
  11. SIMATIC Technical Support
  12. Influence of the ambient conditions on the automation system (AS)
  13. Communication between sensors/actuators and the automation system
  14. Communication
  15. Installing an S7 system
  16. Modules in an S7-300
  17. Components of an S7-300:
  18. Horizontal and vertical installation
  19. Rails - overview
  20. Shielding contact element
  21. Assembly
  22. Arranging Modules on Multiple Racks
  23. Full assembly using racks
  24. Types of cabinet
  25. Selection and installation of cabinets
  26. General Rules and Regulations for S7-300 Operation
  27. CPU with grounded reference potential (as supplied)
  28. Creating an ungrounded reference potential on a CPU
  29. Configuration with isolated modules
  30. Configuration with non-isolated modules
  31. Grounding Measures
  32. Connection of the load voltage reference potential
  33. Overview: Grounding
  34. Grounding concept for the S7-300 (excluding CPU 31xC)
  35. Characteristics of load power supply units
  36. Example: S7-300 with load power supply from PS 307
  37. Nodes on the subnet
  38. MPI/PROFIBUS DP addresses
  39. MPI addresses of CPs/FMs in an S7-300
  40. Interfaces
  41. Possible interface operating modes for CPU 317-2 DP
  42. The following devices may be connected
  43. Available bus cables
  44. Marginal conditions for wiring interior bus cables
  45. RS 485 repeater
  46. Cable Length
  47. Stub cable lengths per segment
  48. Example of an MPI subnet
  49. Example: Maximum distances in the MPI subnet
  50. Example of a PROFIBUS subnet
  51. Example: CPU 314C-2 DP as MPI and PROFIBUS nodes
  52. Example of PG access across network boundaries (routing)
  53. S7-300 Modules
  54. Module accessories
  55. Installation tools and materials
  56. Holes for mounting the 2 m rail
  57. Mounting holes for rails
  58. Free space required for an S7-300 installation
  59. Slot numbers for S7 modules
  60. Inserting slot numbers in modules
  61. Wiring
  62. Conditions for connecting the PS and CPU
  63. Wiring conditions for front connectors
  64. Connecting the Protective Conductor to the Rail
  65. Setting the mains voltage selector switch for the PS 307
  66. Wiring the Power Supply Module and the CPU
  67. Assignment of front connectors to modules
  68. Move the front connector into wiring position
  69. Wiring the front connector
  70. Slide the labeled strips into the front panel
  71. Assigning the shielding diameter to shielding terminals
  72. Shielding contact element underneath two signal modules
  73. Connecting 2-wire cables to the shielding contact element
  74. Bus connector: Enabled and disabled terminating resistor
  75. Addressing
  76. S7-300 slots and the associated module start addresses
  77. Addresses of the I/O of digital modules
  78. I/O Addresses of a digital module in Slot 4
  79. I/O addresses of an analog module in Slot 4
  80. Integrated inputs and outputs on the CPU 313C
  81. Consistent Data
  82. Recommended commissioning procedure - part I: Hardware
  83. Recommended commissioning procedure - part II: software
  84. Configuring
  85. Installation
  86. Connecting a PG to an S7-300
  87. Connecting a PG to multiple S7-300 PLCs
  88. Connecting a PG to a subnet
  89. PG connected to an ungrounded S7-300
  90. Insert the micro memory card into the CPU
  91. In this Chapter
  92. Using the mode selector switch to reset the memory
  93. Operations in the CPU during a memory reset
  94. Software requirements
  95. DP address areas of the CPUs
  96. Commissioning the CPU as DP Master
  97. Commissioning the CPU as DP Slave
  98. Intermediate memory in a DP CPU operating as a DP slave
  99. Direct Data Exchange
  100. Direct data exchange with CPUs 31x-2 DP/31xC-2 DP
  101. Back-up of operating system on MMC
  102. Updating the Operating System
  104. Unlocking the front connector and removing the module
  105. Removing the front connector coding pin
  106. Installing a new module
  107. Module replacement
  108. Location of fuses in the digital output module 120/230 VAC
  109. Principle of forcing in S7-300 CPUs
  110. Diagnostics with LEDs
  111. Evaluation of the SF LED (software error)
  113. The BUSF, BUSF1 and BUSF2 LEDs
  114. The BUSF LED lights up
  115. Diagnostics with CPU 31x-2
  116. Diagnostic addresses for DP masters and DP slaves
  117. Event recognition by CPUs 31x-2 as the DP master
  118. Diagnostic address for the receiving station with direct data exchange
  119. Reading slave diagnostic data
  121. Event recognition by CPUs 31x-2 acting as the DP slave
  122. Interrupts on the DP Master
  123. Structure of slave diagnostic data
  124. Structure of station status 1 (byte 0)
  125. Structure of station status 3 (byte 2)
  126. Structure of the ID-specific diagnostics for CPU 31x-2
  127. Structure of the module status
  128. Structure of the interrupt status
  129. Bytes y+4 to y+7 for a diagnostic interrupt (operating status change by intelligent slave)
  130. Bytes y+4 to y+7 for the diagnostic interrupt (SFB 75)
  131. Starting the system after specific events
  132. Mains voltage
  133. Possible paths of electromagnetic interference
  134. Coupling mechanisms
  135. EMC Compatible Installation of PLC
  136. Example of an EMC compatible cabinet installation
  137. Key to example 1
  138. Example of EMC compatible wall-mounting
  139. Equipotential bonding
  141. Routing cables inside buildings
  142. Lightning and Surge Voltage Protection
  143. Lightning Protection Zone Concept
  144. Lightning protection zones of a building
  145. High-voltage protection of cables with surge voltage protection components
  146. Surge voltage protection components for lightning protection zones 1 <-> 2
  147. Surge voltage protection components for lightning protection zones 2 <-> 3
  148. Sample circuit for networked S7-300 PLCs
  149. Example of a lightning-protected structure (key to figure above)
  150. EMERGENCY-OFF relay contact in the output circuit
  151. Circuit for coils operated with DC voltage
  152. Commissioning
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