6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it. (Mostreplacement ES devices are packaged with leads electricallyshorted together by conductive foam, alminum foil or comparableconductive material).7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective material tothe chassis or circuit assembly into which the device will beinstalled.CautionBe sure no power is applied to the chassis or circuit, and observeall other safety precautions.8. Minimize bodily motions when handling unpackaged replacementES devices. (Otherwise hamless motion such as the brushingtogether of your clothes fabric or the lifting of your foot from acarpeted floor can generate static electricity (ESD) sufficient todamage an ES device).4. About lead free solder (PbF)Note: Lead is listed as (Pb) in the periodic table of elements.In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.This model uses Pb Free solder in it’s manufacture due to environmental conservation issues.For service and repair work, we’d suggest the use of Pb free solder as well, although Pb soldermay be used.PCBs manufactured using lead free solder will have the PbF within a leaf Symbolstamped on the back of PCB.Caution- Pb free solder has a higher melting point than standard solder.Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Pleaseuse a high temperature soldering iron and set it to 700 ± 20 °F (3705